1 Department of Biomedical Sciences, College of Medicine, Charles R. Drew University, Los Angeles, CA, United States 2 Department of Biological Chemistry, David Geffen School of Medicine at UCLA, Los ...
SiC’s thermal conductivity, strength, and chemical stability make it ideal for the heat fluxes in 2.5D and 3D chip designs. Silicon carbide (SiC) is best known as the wide-bandgap material driving ...
Abstract: Scaling technology of 3D NAND flash is recently required to implement large-capacity memory and high performance due to recent demand of AI semiconductors ...
Abstract: Three-dimensional (3D) reconstruction of neurons is a critical and evolving area in neuroscience, addressing the substantial challenges presented by weak signals, high noise levels, and ...
1 Department of Electrical and Computer Engineering, School of Engineering and Digital Sciences, Nazarbayev University, Astana, Kazakhstan 2 School of Information Technology and Systems, University of ...
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